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PCB Assembly Capability
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Item
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Capability
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Advantages
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—-Professional Surface-mounting and Through-hole soldering technology
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—-Various sizes like 0805,0603 ,0402,0201 components SMT technology
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—-ICT(In Circuit Test),FCT(Functional Circuit Test)
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—-PCB Assembly With UL,CE,FCC,Rohs Approval
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—-Nitrogen gas reflow soldering technology for SMT.
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—-High Standard SMT&Solder Assembly Line
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—-High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size
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BGA and VFBGA
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Leadless Chip Carriers/CSP
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Double-sided SMT Assembly
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Fine Pitch to 0.8mils
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BGA Repair and Reball
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Part Removal and Replacement
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Quantity
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Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized
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Process
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SMT, Thru-hole Insertion,Dispensing,Coating,V-Cut,FCT,ICT,Underfill etc.
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Solder Type
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Water Soluble Solder Paste, Leaded and Lead-Free ,ALPHA or SMIC Paste.
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Bare Board Size
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Usually within 50mm*50mm to 600mm*480mm,Larger also ok
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File Formate
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Gerber files, Pick-N-Place file, Bill of Materials
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Types of Service
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Turn-key,partial turn-key or consignment
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Component packaging
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Cut Tape,Tube,Reels,Loose Parts
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Turn Time
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Same day service to 15 days service
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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PCB assembly process
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SMT Assembly:Loading—-Printing—–SPI—–Chip Mounter—–Reflow—AOI—–Unloading—–X-RAY—–FCT—–Package DIP Assemble: Insertion—–AOI—–Wave Soldering—–Unloading—–Welding—–Cleaning—–V-Cut—- ICT—–AOI—–FCT—–Conformal
Coating—–Dispensing—–Assemble—–Aging Test—–Function Testing—–Package
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